Browsing by Author Satyanarayan
Showing results 1 to 16 of 16
| Issue Date | Title | Author(s) | Supervisor(s) |
| 2012 | Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature | Prabhu, K.N.; Deshapande, P.; Satyanarayan | - |
| 2013 | Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel-coated aluminum substrate | Prabhu, K.N.; Varun, M.; Satyanarayan | - |
| 2014 | Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds | Bhat, K.N.; Prabhu, K.N.; Satyanarayan | - |
| 2019 | Effect of surface treatment on wetting behavior of copper | Kalgudi S.; Pavithra G.P.; Prabhu K.N.; Koppad P.G.; Venkate Gowda C.; Satyanarayan | - |
| 2012 | Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrate | Satyanarayan; Prabhu, K.N. | - |
| 2019 | The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn 37Pb and Sn 3Ag 0.5Cu | Satyanarayan; Kumarswamy, M.C.; Prabhu, K.N. | - |
| 2011 | Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy | Satyanarayan; Prabhu K.N. | - |
| 2015 | Solder joint reliability of Sn-Cu and Sn-Ag-Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses | Satyanarayan; Prabhu, K.N. | - |
| 2013 | Spreading behavior and evolution of IMCs during reactive wetting of SAC solders on smooth and rough copper substrates | Satyanarayan; Prabhu, K.N. | - |
| 2013 | Wettability of root canal sealers on intraradicular dentine treated with different irrigating solutions | Ballal, N.V.; Tweeny, A.; Khechen, K.; Prabhu, K.N.; Satyanarayan; Tay, F.R. | - |
| 2012 | Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substrates | Nayak, V.U.; Prabhu, K.N.; Stanford, N.; Satyanarayan | - |
| 2013 | Wetting behavior of lead-free solders on copper substrates | Satyanarayan; Prabhu, K.N. | - |
| 2011 | Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures | Satyanarayan; Prabhu, K.N. | - |
| 2010 | Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures | Satyanarayan; Prabhu, K.N. | - |
| 2011 | Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates | Satyanarayan; Prabhu, K.N. | - |
| 2012 | Wetting characteristics of sn-0.7cu lead-free solder alloy on copper substrates | Satyanarayan; Prabhu, K.N. | - |
