Please use this identifier to cite or link to this item:
http://idr.nitk.ac.in/jspui/handle/123456789/10865Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Prabhu, K.N. | - |
| dc.contributor.author | Bali, R. | - |
| dc.contributor.author | Ranjan, R. | - |
| dc.date.accessioned | 2020-03-31T08:23:13Z | - |
| dc.date.available | 2020-03-31T08:23:13Z | - |
| dc.date.issued | 2004 | - |
| dc.identifier.citation | Materials and Design, 2004, Vol.25, 5, pp.447-449 | en_US |
| dc.identifier.uri | http://idr.nitk.ac.in/jspui/handle/123456789/10865 | - |
| dc.description.abstract | The microstructure of a solidifying lead free Sn-3.5Ag solder alloy is found to be highly sensitive to the surface condition of the copper substrate. A transition from lamellar to fine fibrous eutectic structure is observed as the surface condition of the substrate is altered by increasing the surface roughness and application of flux. This is attributed to lowering of interfacial tension and improved wetting of the solidifying solder on the substrate material leading to a better contact at the metal/substrate interface. The results also indicated the importance of surface texture of the substrate and the application of the flux to the quality of the solder/substrate joint. 2003 Elsevier Ltd. All rights reserved. | en_US |
| dc.title | Effect of substrate surface texture and flux coating on the evolution of microstructure during solidification of lead free Sn-3.5Ag solder alloy | en_US |
| dc.type | Article | en_US |
| Appears in Collections: | 1. Journal Articles | |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.