Heat flux transients at the solder/substrate interface in dip soldering

Abstract

In the present work an experimental set-up was designed to simulate the dip soldering conditions. The set-up was used to estimate heat flux transients at the solder/substrate interface during solidification of Sn 3.5Ag solder against copper substrate. The inverse heat conduction problem (IHCP) was solved in the substrate region for estimation of heat flux transients. A reasonably good agreement between measurements and model predictions was achieved validating the inverse model. The computer code developed in the present study could be used to assess the effect of process variables on contact heat flux at the solder/substrate interface.